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Custom Products
The M.S. Kennedy Corp. has developed the unique combination of technical proficiencies required to successfully design and produce power hybrid microcircuits. Power hybrid design requires expertise in analog, digital, and power semiconductor circuit design. Dealing effectively with high current, high voltage, high power and heat dissipation along small signal, high frequency integrated circuits for control offers a disparate set of challenges.
MSK utilizes a combination of Direct Bond Copper or Actively Brazed Copper on ceramic (either Alumina, Beryllium Oxide, Aluminum Nitride, or Silicon Nitride) for the power semiconductor substrates and multilayer thick film on ceramic for the small signal control substrates. Direct Bond Copper and Actively Brazed Copper offer extremely low conductor |
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MSK produces a wide variety of custom hybrids and multi-chip modules (MCM) utilizing our expertise in high performance analog and mixed signal circuit design, computer aided design (CAD), circuit simulation, and a variety of processes, materials, and assembly techniques.
Multilayer thick film, co-fired ceramic, thin film and chip-on-board techniques are all used to offer the ideal combination of performance, reliability, cost and size to suit the application.
When provided with only a schematic, parts list and performance / configuration goals, MSK will produce the hybrid or MCM design for customer approval and then prototypes, generally in less than 12 weeks from start to finish. Production quantities can be scheduled over 12-18 month time periods at a mutually agreed upon delivery schedule. All these resources are offered at the most competitive costs available anywhere today.
For more information regarding MSK or to request literature or a virtual tour CD Rom, CLICK HERE>>> |
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